Specification
Size: 60x50mm.Thermal conductivity: >2.0W/M-KWorking temperature: – 50??~ 240??/span>Primary Use: Thermal coupling of electrical / electronic device to heat sinks.Special Properties: High Conductivity ,Low Bleed and Stable at high temperature.Type: Silicone fluid.Physical From: Grease-like.

Features
a.Silver thermal pasteb.Plastic can packagec.Non-toxic,non-corrosive and ordorlessd.Ideal for CPU, graphics card, the heating element usagePackage Included
1100g Compound Heatsink Thermal Paste